Printed Circuit Board Manufacturing

YLC King Electronics is a custom PCB manufacturer, providing PCB design and fabrication, including circuit board(in all types of materials/thickness/surface treatment)and turnkey PCB assembly. From single-sided, double-sided to complex multi-layer(＞48 layers) circuit board, We can provide you an appropriate solutions for each application, such as: communications, agriculture, industry, consumer electronics, etc.

PCB Fabrication in YLC-King

As an experienced custom PCB manufacturer, we provide one-stop PCB design and fabrication across different industries:

• PCB Development:

PCB development is a multi-stage process that transforms a printed circuit board design into a production-ready product. For complex designs, this process is often iterative, aiming to achieve the highest-quality design within the designated development time frame.

• PCB Manufacturing:

Printed circuit board manufacturing involves actualizing your board design. It comprises a two-step procedure commencing with board fabrication and concluding with the assembly of the printed circuit board (PCBA).

• PCB Testing:

The testing process, also known as bring-up, represents the final step in PCB development, occurring post-manufacturing. During this stage, rigorous testing is conducted to assess the board's capacity to execute its intended operational functions effectively.

PCB Manufacturing Capability

		Capability
Basic Capability	Layers	1-48L
	Materials	Type: High TG, EHalongen free, High Frequency, High CTI, Polyimide
		Brand:Shengyi,ITEQ,Rogers,Isola,Panasonic,Taconic,Arlon
	Board Thickness	0.1-8mm
	Copper Thickness	inner layer 6OZ; out layer: 8OZ
	Surface treatment	HASL、ENIG、Gold Plating、Gold Finger、OSP、Immersion Tin/Silver,Peelable Mask
PCB Type	Rigid board	Back-board,HDI,Multilayer blind/buried vias,buried resistor,buried capacitor,thick copper board,Semiconductor test board
	Flex board	Flex(1-8L), Flex-rigid board(1-16L)
	Metal base board	Alu Base(1-2L,3W/m.k),Cu Base(1-2L,3W/m.k)
Min Track Width/Space	Inner Layer	18um(1/2OZ): 2/2mil
		35um(1OZ): 3/3mil
		70um(2OZ): 4/5mil
		105um(3OZ): 6.5/6.5mil
		140um(4OZ): 8/8mil
		175um(5OZ): 10/10mil
		210um(6OZ): 12/12mil
	Out Layer	12um(1/3OZ): 2/2mil
		18um(1/2OZ): 3/3mil
		35um(1OZ): 5/5mil
		70um(2OZ): 8/8mil
		105um(3OZ): 10/10mil
		140um(4OZ): 10/13mil
		175um(5OZ): 12/15mil
		210um(6OZ): 12/19mil
Drilling	Finished hole size (Mechanical)	0.15-6.3mm
	Finished hole size (laser hole)	0.076-0.2mm
	half hole min size	0.3mm
	thickness aperture ratio	20:01
	HDI Type	1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3(n:buried hole size≤0.3mm)
	back-drilling min size:	0.15mm
Other	Solder mask Colour	Green,White,Black,Blue,Yellow,Red,Purple
	Impedance Control Tolerance	≤5
	Impedance Control Tolerance	5%
Quick turn prototype	2L	24hrs
	4L	48hrs
	6L	72hrs
	8L	72hrs
	10L	4 working days
	12L	4 working days
	4L/6L with blind vias	5 working days
	8L/10L with blind vias	7 working days

PCB Types

Rigid Boards

Rigid-Flex Boards

Flex Boards